World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
33
Citations
4416
World Ranking
6098
National Ranking
73

Best Publications

  • Electrical properties of high-κ gate dielectrics: Challenges, current issues, and possible solutions

    M. Houssa;L. Pantisano;L.-Å. Ragnarsson;R. Degraeve

  • Ultra low-EOT (5 Å) gate-first and gate-last high performance CMOS achieved by gate-electrode optimization

    L.-A. Ragnarsson;Z. Li;J. Tseng;T. Schram

  • Gate-all-around MOSFETs based on vertically stacked horizontal Si nanowires in a replacement metal gate process on bulk Si substrates

    H. Mertens;R. Ritzenthaler;A. Hikavyy;M. S. Kim

  • Passivation and interface state density of SiO2/HfO2-based/polycrystalline-Si gate stacks

    R. J. Carter;E. Cartier;A. Kerber;L. Pantisano

  • Vertically stacked gate-all-around Si nanowire CMOS transistors with dual work function metal gates

    H. Mertens;R. Ritzenthaler;A. Chasin;T. Schram

  • On the thermal stability of atomic layer deposited TiN as gate electrode in MOS devices

    J. Westlinder;T. Schram;L. Pantisano;E. Cartier

  • Tall triple-gate devices with TiN/HfO/sub 2/ gate stack

    N. Collaert;M. Demand;I. Ferain;J. Lisoni

  • Challenges of Wafer‐Scale Integration of 2D Semiconductors for High‐Performance Transistor Circuits

    Unknown

  • Estimation of fixed charge densities in hafnium-silicate gate dielectrics

    V.S. Kaushik;B.J. O'Sullivan;G. Pourtois;N. Van Hoornick

  • 2D materials: roadmap to CMOS integration

    C. Huyghebaert;T. Schram;Q. Smets;T. Kumar Agarwal

  • Multiring Circular Transmission Line Model for Ultralow Contact Resistivity Extraction

    Hao Yu;Marc Schaekers;Tom Schram;Erik Rosseel

  • Ultrathin EOT high-κ/metal gate devices for future technologies: Challenges, achievements and perspectives (invited)

    L. . Ragnarsson;T. Chiarella;M. Togo;T. Schram

  • Influence of Al2O3 crystallization on band offsets at interfaces with Si and TiNx

    V. V. Afanas'ev;M. Houssa;A. Stesmans;C. Merckling

  • Strained Germanium Gate-All-Around pMOS Device Demonstration Using Selective Wire Release Etch Prior to Replacement Metal Gate Deposition

    L. Witters;H. Arimura;F. Sebaai;A. Hikavyy

  • Ruthenium gate electrodes on SiO2 and HfO2: Sensitivity to hydrogen and oxygen ambients

    L. Pantisano;T. Schram;Z. Li;J. G. Lisoni

  • Performance comparison of sub 1 nm sputtered TiN/HfO/sub 2/ nMOS and pMOSFETs

    W. Tsai;L.-A. Ragnarsson;L. Pantisano;P.J. Chen

  • Strained germanium gate-all-around PMOS device demonstration using selective wire release etch prior to replacement metal gate deposition

    L. Witters;F. Sebaai;A. Hikavyy;A. P. Milenin

  • Characterization of field-effect transistors with La2Hf2O7 and HfO2 gate dielectric layers deposited by molecular-beam epitaxy

    Z. M. Rittersma;J. C. Hooker;G. Vellianitis;J.-P. Locquet

  • Achieving Conduction Band-Edge Effective Work Functions by $\hbox{La}_{2}\hbox{O}_{3}$ Capping of Hafnium Silicates

    L.-A. Ragnarsson;V.S. Chang;Hong Yu Yu;Hag-Ju Cho

  • Wafer-scale integration of double gated WS 2 -transistors in 300mm Si CMOS fab

    I. Asselberghs;Q. Smets;T. Schram;B. Groven

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