The chart shows the distribution of publications by all Research.com ranked scientists in the field of Mechanical and Aerospace Engineering in 2026. The highlighted bar marks where Shou-Shing Hsieh sits on this spectrum.
This scientist: 134 publications — 18th percentile
18% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 659 publications or more.
The chart shows the D-index (discipline H-index) distribution of Mechanical and Aerospace Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Shou-Shing Hsieh sits on this spectrum.
This scientist: 30 D-Index — 2nd percentile
2% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 93 D-Index or more.
Shou-Shing Hsieh is a researcher affiliated with National Sun Yat-sen University in Taiwan, specializing primarily in engineering with a focus on mechanical engineering, computational mechanics, and electrical and electronic engineering. Their work spans multiple interconnected subfields, including plant science and biomedical engineering.
The main research topics explored by Shou-Shing Hsieh involve fluid dynamics and heat transfer, heat transfer mechanisms, and heat transfer optimization. Additional topics that frequently appear in their work include heat transfer and boiling studies, electrohydrodynamics and fluid dynamics, plant surface properties and treatments, as well as nanomaterials and printing technologies.
The publication record demonstrates a focus on thermal and fluid engineering, with contributions to several scientific journals. Key venues where the researcher's work has appeared include:
Selected recent papers authored by Shou-Shing Hsieh provide insight into their research themes:
Research collaborations are marked by frequent co-authorship with several researchers, including:
Shou-Shing Hsieh's work integrates experimental and theoretical approaches to enhance understanding of convective heat transfer, spray cooling techniques, and related thermal phenomena, often employing specialized equipment such as piezoelectric atomizers in their investigations.
Shou-Shing Hsieh;Huang-Hsiu Tsai;Chih-Yi Lin;Ching-Feng Huang
Shou-Shing Hsieh;Tsung-Cheng Fan;Huang-Hsui Tsai
S. S. Hsieh;C. Y. Lin;C. F. Huang;H. H. Tsai
Shou-Shing Hsieh;Ron-Yu Lee;Jin-Cherng Shyu;Shao-Wen Chen
Shou-Shing Hsieh;Sheng-Huang Yang;Jenn-Kun Kuo;Chin-Feng Huang
Shou-Shing Hsieh;Chih-Yi Lin;Chin-Feng Huang;Huang-Hsiu Tsai
Shou-Shing Hsieh;Jyun-Wei Lin;Jyun-Hong Chen
Shou-Shing Hsieh;Chih-Yi Lin
Shou-Shing Hsieh;Hsin-Yuan Leu;Hao-Hsiang Liu
Shou-Shing Hsieh;Yu-Fan Hsu;Meng-Lin Wang
Shou-Shing Hsieh;Ya-Ru Yang
Shou-Shing Hsieh;Chun-Jen Weng
Shou-Shing Hsieh;Ching-Feng Huang;Chih-Lun Feng
Shou-Shing Hsieh;Bing-Shyan Her;Yi-Ji Huang
Ying-Jong Hong;Shou-Shing Hsieh
Shou-Shing Hsieh;Sheng-Huang Yang;Chih-Lun Feng
Shou-Shing Hsieh;Guo-Zhen Huang;Huang-Hsiu Tsai
S. S. Hsieh;J. K. Kuo;C. F. Hwang;H. H. Tsai
Shou-Shing Hsieh;Chi-Hsun Tien
Shou-Shing Hsieh;Tsung-Cheng Fan;Huang-Hsui Tsai
Shou-Shing Hsieh;Sueng-Yang Luo
Shou-Shing Hsieh;Ching-Fang Huang;Jenn-Kun Kuo;Huang-Hsiu Tsai
Shou-Shing Hsieh;Kuan-Ming Chu
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