World's Best Scientists 2026 revealed!

D-Index & Metrics

Computer Science

D-Index
31
Citations
3404
World Ranking
13757
National Ranking
370

Best Publications

  • An Asynchronous NOC Architecture Providing Low Latency Service and Its Multi-Level Design Framework

    Unknown

  • Globally Asynchronous, Locally Synchronous Circuits: Overview and Outlook

    Unknown

  • A new contactless smart card IC using an on-chip antenna and an asynchronous microcontroller

    Unknown

  • A 477mW NoC-based digital baseband for MIMO 4G SDR

    Fabien Clermidy;Christian Bernard;Romain Lemaire;Jerome Martin

  • A Reconfigurable Baseband Platform Based on an Asynchronous Network-on-Chip

    Unknown

  • A fully-asynchronous low-power framework for GALS NoC integration

    Unknown

  • IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management

    Unknown

  • An Asynchronous Power Aware and Adaptive NoC Based Circuit

    Unknown

  • Dynamic Voltage and Frequency Scaling Architecture for Units Integration within a GALS NoC

    Unknown

  • Design of On-chip and Off-chip Interfaces for a GALS NoC Architecture

    Unknown

  • 3D Sequential Integration: Application-driven technological achievements and guidelines

    P. Batude;L. Brunet;C. Fenouillet-Beranger;F. Andrieu

  • A Power Supply Selector for Energy- and Area-Efficient Local Dynamic Voltage Scaling

    Unknown

  • A fully-asynchronous low-power framework for GALS NoC integration

    Unknown

  • Physical Implementation of the DSPIN Network-on-Chip in the FAUST Architecture

    Unknown

  • A 0.9 pJ/bit, 12.8 GByte/s WideIO memory interface in a 3D-IC NoC-based MPSoC

    Unknown

  • Design and Implementation of a GALS Adapter for ANoC Based Architectures

    Unknown

  • Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures

    Unknown

  • A Telecom Baseband Circuit based on an Asynchronous Network-on-Chip

    Unknown

  • Power Modeling in SystemC at Transaction Level, Application to a DVFS Architecture

    Unknown

  • 2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm 2 Inter-Chiplet Interconnects and 156mW/mm 2 @ 82%-Peak-Efficiency DC-DC Converters

    Unknown

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