The chart shows the distribution of publications by all Research.com ranked scientists in the field of Engineering and Technology in 2026. The highlighted bar marks where M. S. Beck sits on this spectrum.
This scientist: 101 publications — 9th percentile
9% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 804 publications or more.
The chart shows the D-index (discipline H-index) distribution of Engineering and Technology scientists ranked by Research.com in 2026. The highlighted bar marks where M. S. Beck sits on this spectrum.
This scientist: 40 D-Index — 27th percentile
27% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 107 D-Index or more.
The scientist’s investigation covers issues in Capacitance, Tomography, Electrical engineering, Process tomography and Electronic engineering. Maurice S. Beck works on Capacitance which deals in particular with Electrical capacitance tomography. His work on Transducer and Transductor is typically connected to Capacitance transducer and Charge as part of general Electrical engineering study, connecting several disciplines of science.
His studies deal with areas such as Pipeline transport, Tomographic reconstruction and Systems engineering as well as Process tomography. In his research, Inductance is intimately related to Iterative reconstruction, which falls under the overarching field of Electronic engineering. His Sensitivity research is multidisciplinary, incorporating perspectives in Mechanics, Flow, Stratified flows and Linearity.
The scientist’s investigation covers issues in Tomography, Capacitance, Acoustics, Electrical engineering and Mechanics. The concepts of his Tomography study are interwoven with issues in Electronic engineering and Iterative reconstruction. Maurice S. Beck has included themes like Electrical resistivity and conductivity and Flow measurement in his Acoustics study.
His study in the field of Phase, Amplifier and 500 kHz is also linked to topics like Measuring instrument and Multi phase. Many of his research projects under Mechanics are closely connected to Fluidized bed combustion and Coalescence with Fluidized bed combustion and Coalescence, tying the diverse disciplines of science together. His work deals with themes such as Data science, Process engineering and Robustness, which intersect with Process tomography.
Maurice S. Beck mostly deals with Tomography, Electrical capacitance tomography, Mechanics, Process tomography and Mineralogy. He undertakes interdisciplinary study in the fields of Tomography and Capacitance through his works. His work on Flow and Liquid bubble as part of his general Mechanics study is frequently connected to Air core, Fluidization and Coalescence, thereby bridging the divide between different branches of science.
His Process tomography research incorporates themes from Systems engineering, Robustness and Data science. His research integrates issues of Electrical impedance tomography, Rope and Hydrocyclone in his study of Mineralogy. His Acoustics research is multidisciplinary, incorporating elements of Excitation and Sensitivity.
Maurice S. Beck focuses on Tomography, Process tomography, Iterative reconstruction, Electronic engineering and Electrical capacitance tomography. His Process tomography research integrates issues from Tomographic reconstruction and Systems engineering. His Iterative reconstruction study incorporates themes from Electrical engineering and Inductance.
The study incorporates disciplines such as Acoustics, Ultrasonic sensor and Ultrasound Tomography in addition to Electronic engineering. His work often combines Electrical capacitance tomography and Optoelectronics studies.
C.G. Xie;S.M. Huang;B.S. Hoyle;R. Thorn
R. A. Williams;M. S. Beck
S M Huang;A B Plaskowski;C G Xie;M S Beck
S M Huang;A L Stott;R G Green;M S Beck
M. S. Beck;Richard A Williams
A J Peyton;Z Z Yu;G Lyon;S Al-Zeibak
S.M. Huang;C.G. Xie;R. Thorn;D. Snowden
M S Beck
W. Q. Yang;A. L. Stott;M. S. Beck;C. G. Xie
C G Xie;A L Stott;A Plaskowski;M S Beck
S.M. Huang;A.B. Plaskowski;C.G. Xie;M.S. Beck
S. Huang;R.G. Green;A. Plaskowski;M.S. Beck
W.Q. Yang;A.L. Stott;M.S. Beck
M.S Beck;R Thorn;A Plaskowski
C.G. Xie;N. Reinecke;M.S. Beck;D. Mewes
S.J. Wang;T. Dyakowski;C.G. Xie;R.A. Williams
Ming Yang;H.I. Schlaberg;B.S. Hoyle;M.S. Beck
M S Beck;M Byars;T Dyakowski;R Waterfall
W Q Yang;M R Brant;M S Beck
T. M. Shi;C. G. Xie;S. M. Huang;Richard A Williams
W Yang
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