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Microelectronics Reliability
H-index 19

Microelectronics Reliability

Ranking & Metrics

Discipline name Position Best Scientists Publications D-Index
Electronics and Electrical Engineering 225 108 211 16
Materials Science 473 75 124 13
Engineering and Technology 801 34 57 10

Additional Metrics

Number of Best Scientists*: 256
Documents by Best Scientists*: 384
Top 100 Ranked Scientists*: 9
SCIMAGO H-index: 110
SCIMAGO SJR: 0.436
Impact Factor: 1.9

Overview

Top Research Topics at Microelectronics Reliability?

Microelectronics Reliability mainly deals with areas of study such as Optoelectronics, Electronic engineering, Electrical engineering, Reliability engineering and Reliability (semiconductor). Microelectronics Reliability holds forums on Optoelectronics that merges themes from other disciplines such as Threshold voltage, Transistor, Gate oxide and Stress (mechanics). In addition to Electronic engineering research, it aims to explore topics under Power (physics), Electronic circuit, Chip and Integrated circuit.

The journal covers various topics on Electrical engineering such as Voltage and MOSFET. The Reliability engineering study featured in Microelectronics Reliability draws parallels with the field of Reliability (statistics).

  • Optoelectronics (20.89%)
  • Electronic engineering (20.76%)
  • Electrical engineering (16.74%)

What are the most cited papers published in the journal?

  • A review of recent MOSFET threshold voltage extraction methods (626 citations)
  • Selected failure mechanisms of modern power modules (624 citations)
  • A comprehensive model of PMOS NBTI degradation (616 citations)

Research areas of the most cited articles at Microelectronics Reliability:

The most cited papers are organized to reinforce research efforts on Electronic engineering, Electrical engineering, Optoelectronics, Reliability (semiconductor) and Composite material. The studies on Electronic engineering discussed at the most cited publications can also contribute to research in the domains of Electronic circuit, MOSFET, Chip and Integrated circuit. Issues in Optoelectronics were discussed in the most cited papers, taking into consideration concepts from other disciplines like Transistor and Stress (mechanics).

What topics the last edition of the journal is best known for?

  • Quantum mechanics
  • Composite material
  • Statistics

The previous edition focused in particular on these issues:

Microelectronics Reliability mostly deals with topics like Optoelectronics, Composite material, Reliability (semiconductor), Electronic engineering and Voltage. The journal focuses on Optoelectronics but the discussions also offer insight into other areas such as Transistor, MOSFET and Degradation (geology). Soldering, Joint (geology), Stress (mechanics) and Microstructure are some of the study areas of Composite material discussed.

Microelectronics Reliability features Soldering research that overlaps with concepts in Temperature cycling. The Stress (mechanics) study featured in it draws connections with the study of Finite element method. The studies tackled, which mainly focus on Electronic engineering, apply to Electronic circuit as well.

The most cited articles from the last journal are:

  • The investigation of current condition mechanism of Al/Y2O3/p-Si Schottky barrier diodes in wide range temperature and illuminate (4 citations)
  • Understanding and eliminating thermo-mechanically induced radial cracks in fully metallized through-glass via (TGV) substrates (3 citations)
  • Design optimization of a miniaturized thermoelectric generator via parametric model order reduction (3 citations)

Papers citation over time

A key indicator for each journal is its effectiveness in reaching other researchers with the papers published at that venue.

The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.

The top authors publishing in Microelectronics Reliability (based on the number of publications) are:

  • Gaudenzio Meneghesso (130 papers) published 4 papers at the last edition, 6 less than at the previous edition,
  • Enrico Zanoni (123 papers) published 7 papers at the last edition, 2 less than at the previous edition,
  • Balbir S. Dhillon (100 papers) absent at the last edition,
  • Mile K. Stojcev (97 papers) absent at the last edition,
  • Philippe Perdu (83 papers) absent at the last edition.

The overall trend for top authors publishing in this journal is outlined below. The chart shows the number of publications at each edition of the journal for top authors.

Only papers with recognized affiliations are considered

The top affiliations publishing in Microelectronics Reliability (based on the number of publications) are:

  • STMicroelectronics (367 papers) published 8 papers at the last edition, 1 more than at the previous edition,
  • Infineon Technologies (240 papers) published 1 paper at the last edition, 4 less than at the previous edition,
  • Katholieke Universiteit Leuven (203 papers) published 3 papers at the last edition, 11 less than at the previous edition,
  • Centre national de la recherche scientifique (179 papers) published 2 papers at the last edition, 5 less than at the previous edition,
  • University of Bordeaux (174 papers) published 5 papers at the last edition, 4 more than at the previous edition.

The overall trend for top affiliations publishing in this journal is outlined below. The chart shows the number of publications at each edition of the journal for top affiliations.

Publication chance based on affiliation

The publication chance index shows the ratio of articles published by the best research institutions in the journal edition to all articles published within that journal. The best research institutions were selected based on the largest number of articles published during all editions of the journal.

The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.

During the most recent 2021 edition, 25.62% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 16.18% were posted by at least one author from the top 10 institutions publishing in the journal. Another 4.56% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 14.94% of all publications and 64.32% were from other institutions.

Returning Authors Index

A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of journals they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same journal from year to year.

The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the journal in relation to all participants in a given year.

Returning Institution Index

The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.

The experience to innovation index

Our experience to innovation index was created to show a cross-section of the experience level of authors publishing in a journal. The index includes the authors publishing at the last edition of a journal, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).

The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:

  • Novice - P < 5 or C < 25 (the number of publications less than 5 or the number of citations less than 25),
  • Competent - P < 10 or C < 100 (the number of publications less than 10 or the number of citations less than 100),
  • Experienced - P < 25 or C < 625 (the number of publications less than 25 or the number of citations less than 625),
  • Master - P < 50 or C < 2500 (the number of publications less than 50 or the number of citations less than 2500),
  • Star - P ≥ 50 and C ≥ 2500 (both the number of publications greater than 50 and the number of citations greater than 2500).

The chart below illustrates experience levels of first authors in cases of publications with multiple authors.

Top Publications

  • Development of low temperature CuCu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)

    Han-Wen Hu;Kuan-Neng Chen

    (2021)
    102 Citations
  • A lithium-ion battery remaining useful life prediction method based on the incremental capacity analysis and Gaussian process regression

    (2021)
    75 Citations
  • Defect inspection of flip chip solder joints based on non-destructive methods: A review

    Lei Su;Xiaonan Yu;Ke Li;Michael Pecht

    (2020)
    52 Citations
  • FlexGripPlus: An improved GPGPU model to support reliability analysis

    Josie E. Rodriguez Condia;Boyang Du;Matteo Sonza Reorda;Luca Sterpone

    (2020)
    50 Citations
  • A highly stable reliable SRAM cell design for low power applications

    Soumitra Pal;Subhankar Bose;Wing-Hung Ki;Aminul Islam

    (2020)
    42 Citations
  • Microstructure evolution and hardness of MWCNT-reinforced Sn-5Sb/Cu composite solder joints under different thermal aging conditions

    T.T. Dele-Afolabi;M.A. Azmah Hanim;R. Calin;R.A. Ilyas

    (2020)
    37 Citations
  • The thermal cycling reliability of copper pillar solder bump in flip chip via thermal compression bonding

    Junhui Li;Yuexin Zhang;Haoliang Zhang;Zhuo Chen

    (2020)
    32 Citations
  • Challenges to overcome breakdown limitations in lateral β-Ga2O3 MOSFET devices

    Kornelius Tetzner;Oliver Hilt;Andreas Popp;Saud Bin Anooz

    (2020)
    32 Citations
  • Lithium-ion battery SoH estimation based on incremental capacity peak tracking at several current levels for online application

    M. Maures;A. Capitaine;J.-Y. Delétage;J.-M. Vinassa

    (2020)
    29 Citations
  • Surge current capability of ultra-wide-bandgap Ga2O3 Schottky diodes

    Cyril Buttay;Hiu-Yung Wong;Boyan Wang;Ming Xiao

    (2020)
    26 Citations

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Best Scientists Contributing to This Journal