| Discipline name | Position | Best Scientists | Publications | D-Index |
|---|---|---|---|---|
| Electronics and Electrical Engineering | 225 | 108 | 211 | 16 |
| Materials Science | 473 | 75 | 124 | 13 |
| Engineering and Technology | 801 | 34 | 57 | 10 |
Microelectronics Reliability mainly deals with areas of study such as Optoelectronics, Electronic engineering, Electrical engineering, Reliability engineering and Reliability (semiconductor). Microelectronics Reliability holds forums on Optoelectronics that merges themes from other disciplines such as Threshold voltage, Transistor, Gate oxide and Stress (mechanics). In addition to Electronic engineering research, it aims to explore topics under Power (physics), Electronic circuit, Chip and Integrated circuit.
The journal covers various topics on Electrical engineering such as Voltage and MOSFET. The Reliability engineering study featured in Microelectronics Reliability draws parallels with the field of Reliability (statistics).
The most cited papers are organized to reinforce research efforts on Electronic engineering, Electrical engineering, Optoelectronics, Reliability (semiconductor) and Composite material. The studies on Electronic engineering discussed at the most cited publications can also contribute to research in the domains of Electronic circuit, MOSFET, Chip and Integrated circuit. Issues in Optoelectronics were discussed in the most cited papers, taking into consideration concepts from other disciplines like Transistor and Stress (mechanics).
Microelectronics Reliability mostly deals with topics like Optoelectronics, Composite material, Reliability (semiconductor), Electronic engineering and Voltage. The journal focuses on Optoelectronics but the discussions also offer insight into other areas such as Transistor, MOSFET and Degradation (geology). Soldering, Joint (geology), Stress (mechanics) and Microstructure are some of the study areas of Composite material discussed.
Microelectronics Reliability features Soldering research that overlaps with concepts in Temperature cycling. The Stress (mechanics) study featured in it draws connections with the study of Finite element method. The studies tackled, which mainly focus on Electronic engineering, apply to Electronic circuit as well.
A key indicator for each journal is its effectiveness in reaching other researchers with the papers published at that venue.
The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.
The top authors publishing in Microelectronics Reliability (based on the number of publications) are:
The overall trend for top authors publishing in this journal is outlined below. The chart shows the number of publications at each edition of the journal for top authors.
Only papers with recognized affiliations are considered
The top affiliations publishing in Microelectronics Reliability (based on the number of publications) are:
The overall trend for top affiliations publishing in this journal is outlined below. The chart shows the number of publications at each edition of the journal for top affiliations.
The publication chance index shows the ratio of articles published by the best research institutions in the journal edition to all articles published within that journal. The best research institutions were selected based on the largest number of articles published during all editions of the journal.
The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.
During the most recent 2021 edition, 25.62% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 16.18% were posted by at least one author from the top 10 institutions publishing in the journal. Another 4.56% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 14.94% of all publications and 64.32% were from other institutions.
A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of journals they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same journal from year to year.
The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the journal in relation to all participants in a given year.
The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.
Our experience to innovation index was created to show a cross-section of the experience level of authors publishing in a journal. The index includes the authors publishing at the last edition of a journal, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).
The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:
The chart below illustrates experience levels of first authors in cases of publications with multiple authors.
Han-Wen Hu;Kuan-Neng Chen
(2021)Lei Su;Xiaonan Yu;Ke Li;Michael Pecht
(2020)Josie E. Rodriguez Condia;Boyang Du;Matteo Sonza Reorda;Luca Sterpone
(2020)Soumitra Pal;Subhankar Bose;Wing-Hung Ki;Aminul Islam
(2020)T.T. Dele-Afolabi;M.A. Azmah Hanim;R. Calin;R.A. Ilyas
(2020)Junhui Li;Yuexin Zhang;Haoliang Zhang;Zhuo Chen
(2020)Kornelius Tetzner;Oliver Hilt;Andreas Popp;Saud Bin Anooz
(2020)M. Maures;A. Capitaine;J.-Y. Delétage;J.-M. Vinassa
(2020)Cyril Buttay;Hiu-Yung Wong;Boyan Wang;Ming Xiao
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