| Discipline name | Position | Best Scientists | Publications | D-Index |
|---|---|---|---|---|
| Electronics and Electrical Engineering | 411 | 28 | 51 | 6 |
The aim of IEEE Electromagnetic Compatibility Magazine is to expand the discussion of research in Electromagnetic compatibility, Electronic engineering, Electrical engineering, Telecommunications and Electromagnetic interference. IEEE Electromagnetic Compatibility Magazine features Electromagnetic compatibility research that overlaps with concepts in Systems engineering. Topics in Electronic engineering explored in it were investigated in conjunction with research in Electrical impedance and Signal integrity.
The studies tackled, which mainly focus on Electrical engineering, apply to Power (physics) as well. Wireless is a focus of the presented Telecommunications works and it dives deep in Wireless. EMI is a key component of Electromagnetic interference research discussed in the journal.
The Power integrity study featured falls within the larger field of Signal.
The published articles aim to foster the development of research in Electrical engineering, Electronic engineering, Electromagnetic interference, Electromagnetic compatibility and Acoustics. The published Electronic engineering works encompass concepts such as Digital signal processing and examines them in conjunction with Physics based. The most cited papers about Electromagnetic compatibility cover related areas such as Immunity Testing and also touches on topics like Iso standards.
Electromagnetic compatibility, Electrical engineering, Power integrity, Telecommunications and Work (electrical) are among the topics commonly tackled in IEEE Electromagnetic Compatibility Magazine. IEEE Electromagnetic Compatibility Magazine encompasses Electromagnetic compatibility studies in the context of Electronic engineering as a whole. Printed circuit board and Signal are among the areas of Electrical engineering tackled.
The presented Printed circuit board research focuses mostly on Characterization (materials science) and, on occasion, topics in Electromagnetic shielding. Interference (communication), Radio broadcasting and Radio reception studies in the realm of Telecommunications interact with fields like Carry (arithmetic). Topics in Work (electrical) were tackled in line with various other fields like Government, Job interview and Media studies.
A key indicator for each journal is its effectiveness in reaching other researchers with the papers published at that venue.
The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.
The top authors publishing in IEEE Electromagnetic Compatibility Magazine (based on the number of publications) are:
The overall trend for top authors publishing in this journal is outlined below. The chart shows the number of publications at each edition of the journal for top authors.
Only papers with recognized affiliations are considered
The top affiliations publishing in IEEE Electromagnetic Compatibility Magazine (based on the number of publications) are:
The overall trend for top affiliations publishing in this journal is outlined below. The chart shows the number of publications at each edition of the journal for top affiliations.
The publication chance index shows the ratio of articles published by the best research institutions in the journal edition to all articles published within that journal. The best research institutions were selected based on the largest number of articles published during all editions of the journal.
The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.
During the most recent 2021 edition, 63.33% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 27.27% were posted by at least one author from the top 10 institutions publishing in the journal. Another 0.00% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 27.27% of all publications and 45.45% were from other institutions.
A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of journals they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same journal from year to year.
The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the journal in relation to all participants in a given year.
The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.
Our experience to innovation index was created to show a cross-section of the experience level of authors publishing in a journal. The index includes the authors publishing at the last edition of a journal, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).
The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:
The chart below illustrates experience levels of first authors in cases of publications with multiple authors.
Todd H. Hubing;James L. Drewniak;Thomas P. Van Doren;David M. Hockanson
(2020)V. Mariani Primiani;M. Barazzetta;L. Bastianelli;D. Micheli
(2020)Yury V. Kuznetsov;Andrey B. Baev;Maxim A. Konovalyuk;Anastasia A. Gorbunova
(2020)Biyao Zhao;Shuang Liang;Samuel Connor;Matteo Cocchini
(2020)Biyao Zhao;Siqi Bai;Samuel Connor;Stephen Scearce
(2020)Aristeides Papadopoulos;Theodoros Zygiridis;Elias Glytsis;Nikolaos Kantartzis
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