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IEEE

2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)

Location: Guangzhou , China

Submission deadline: 8/15/2022

Conference dates: 11/13/2022 - 11/15/2022

Research H-index
5

Ranking & Metrics

Discipline name Position Best Scientists Publications D-Index
Materials Science 74 35 49 3
Electronics and Electrical Engineering 368 90 262 5
Engineering and Technology 351 22 37 2

Call for Papers

The topics include, but are not limited to, the following technical areas:

Emerging electronic and optoelectronic devices (e.g. carbon nanotube, 2D materials and beyond)
Wide bandgap and other emerging semiconductor materials (e.g. ionic materials) based electronic devices and circuits
Advanced silicon, integrated passive devices and integrated circuits
Monolithic integrated circuits
Low-temperature co-fired ceramic and liquid crystal polymer based microwave devices and circuits
Large-area printing, inkjet printing and 3D printing materials and processes for RF and THz applications
Integrated passive devices and advanced packaging for RF applications
Advanced materials (flexible, ferromagnetic and superconducting materials etc.) for RF electronics and antennas
Engineered metamaterials and plasmonics for absorption, cloaking, and wave manipulation
Passive/active microwave and terahertz devices and circuits
Antennas with advanced/complex/artificial materials and processes
Microwave and millimeter wave antennas and antenna arrays

Overview

The ranking presented on this page meticulously lists scientific conferences in the field of Electronics and Electrical Engineering. Developed by Research.com—a recognized leader in providing reliable and comprehensive data on science research across all major disciplines—this ranking underscores the organization’s commitment to delivering trusted insights into scientific contributions since 2014.

Conference positions in the ranking are determined by a unique bibliometric score, specifically engineered by Research.com. This score integrates the estimated h-index and considers the number of leading scientists who have participated in each conference over the preceding three years. The resulting Impact Score values, which provide a quantitative assessment of each event's influence within the scientific community, were collected most recently on 2024-11-27.

The ranking process was grounded in a rigorous and systematic examination: over 2,204 conferences underwent detailed scrutiny, drawing from a comprehensive analysis of more than 95,378 scientific documents authored in the last three years by 6,160 prominent and respected researchers in Electronics and Electrical Engineering. This methodical approach ensures that the ranking is both authoritative and reflective of genuine scholarly impact.

For readers interested in a deeper understanding of the analysis and ranking methodology employed, further details are comprehensively presented on our Methodology Page.

Papers citation over time

A key indicator for each conference is its effectiveness in reaching other researchers with the papers published at that venue.

The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.

The top authors publishing at IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (based on the number of publications) are:

  • Yong Fan (17 papers) published 2 papers at the last edition,
  • Maurizio Bozzi (15 papers) absent at the last edition,
  • Wenquan Che (14 papers) published 5 papers at the last edition,
  • Shaobo Qu (14 papers) absent at the last edition,
  • Luca Perregrini (11 papers) absent at the last edition.

The overall trend for top authors publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top authors.

Only papers with recognized affiliations are considered

The top affiliations publishing at IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (based on the number of publications) are:

  • University of Electronic Science and Technology of China (82 papers) published 10 papers at the last edition,
  • Nanjing University of Science and Technology (28 papers) published 9 papers at the last edition,
  • Southeast University (24 papers) published 2 papers at the last edition,
  • National University of Singapore (19 papers) published 5 papers at the last edition,
  • University of Pavia (18 papers) absent at the last edition.

The overall trend for top affiliations publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top affiliations.

Publication chance based on affiliation

The publication chance index shows the ratio of articles published by the best research institutions at the conference edition to all articles published within that conference. The best research institutions were selected based on the largest number of articles published during all editions of the conference.

The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.

During the most recent 2020 edition, 9.68% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 39.29% were posted by at least one author from the top 10 institutions publishing at the conference. Another 17.86% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 18.75% of all publications and 24.11% were from other institutions.

Returning Authors Index

A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of conferences they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same conference from year to year.

The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the conference in relation to all participants in a given year.

Returning Institution Index

The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.

The experience to innovation index

Our experience to innovation index was created to show a cross-section of the experience level of authors publishing at a conference. The index includes the authors publishing at the last edition of a conference, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).

The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:

  • Novice - P < 5 or C < 25 (the number of publications less than 5 or the number of citations less than 25),
  • Competent - P < 10 or C < 100 (the number of publications less than 10 or the number of citations less than 100),
  • Experienced - P < 25 or C < 625 (the number of publications less than 25 or the number of citations less than 625),
  • Master - P < 50 or C < 2500 (the number of publications less than 50 or the number of citations less than 2500),
  • Star - P ≥ 50 and C ≥ 2500 (both the number of publications greater than 50 and the number of citations greater than 2500).

The chart below illustrates experience levels of first authors in cases of publications with multiple authors.

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