F. Boeuf

Best Publications

• Roadmap on silicon photonics

  David Thomson;Aaron Zilkie;John E Bowers;Tin Komljenovic

  1360
  Citations

• The end of CMOS scaling: toward the introduction of new materials and structural changes to improve MOSFET performance

  T. Skotnicki;J.A. Hutchby;Tsu-Jae King;H.-S.P. Wong

  557
  Citations

• 28nm FDSOI technology platform for high-speed low-voltage digital applications

  N. Planes;O. Weber;V. Barral;S. Haendler

  491
  Citations

• Plasma wave detection of terahertz radiation by silicon field effects transistors: Responsivity and noise equivalent power

  R. Tauk;F. Teppe;S. Boubanga;D. Coquillat

  432
  Citations

• Plasma wave detection of sub-terahertz and terahertz radiation by silicon field-effect transistors

  W. Knap;F. Teppe;Y. Meziani;N. Dyakonova

  397
  Citations

• Multi- $V_{T}$ UTBB FDSOI Device Architectures for Low-Power CMOS Circuit

  J-P Noel;O. Thomas;M. Jaud;O. Weber

  255
  Citations

• Efficient low-loss InGaAsP/Si hybrid MOS optical modulator

  Jae-Hoon Han;Jae-Hoon Han;Frederic Boeuf;Junichi Fujikata;Shigeki Takahashi

  222
  Citations

• High immunity to threshold voltage variability in undoped ultra-thin FDSOI MOSFETs and its physical understanding

  O. Weber;O. Faynot;F. Andrieu;C. Buj-Dufournet

  214
  Citations

• Innovative Materials, Devices, and CMOS Technologies for Low-Power Mobile Multimedia

  Unknown

  211
  Citations

• Ultra-low-threshold continuous-wave and pulsed lasing in tensile-strained GeSn alloys

  Anas Elbaz;Anas Elbaz;Dan Buca;Nils von den Driesch;Nils von den Driesch;Konstantinos Pantzas

  196
  Citations

• Germanium avalanche receiver for low power interconnects.

  Léopold Virot;Paul Crozat;Jean-Marc Fédéli;Jean-Michel Hartmann

  170
  Citations

• Unexpected mobility degradation for very short devices : A new challenge for CMOS scaling

  Antoine Cros;Krunoslav Romanjek;Dominique Fleury;Samuel Harrison

  146
  Citations

• Silicon Photonics R&D and Manufacturing on 300-mm Wafer Platform

  Frederic Boeuf;Sebastien Cremer;Enrico Temporiti;Massimo Fere

  118
  Citations

• Integrated waveguide PIN photodiodes exploiting lateral Si/Ge/Si heterojunction.

  Léopold Virot;Daniel Benedikovic;Bertrand Szelag;Carlos Alonso-Ramos

  115
  Citations

• Low leakage and low variability Ultra-Thin Body and Buried Oxide (UT2B) SOI technology for 20nm low power CMOS and beyond

  F. Andrieu;O. Weber;J. Mazurier;O. Thomas

  111
  Citations

• A multi-wavelength 3D-compatible silicon photonics platform on 300mm SOI wafers for 25Gb/s applications

  F. Boeuf;S. Cremer;N. Vulliet;T. Pinguet

  109
  Citations

• L-shaped fiber-chip grating couplers with high directionality and low reflectivity fabricated with deep-UV lithography

  Daniel Benedikovic;Carlos Alonso-Ramos;Diego Pérez-Galacho;Sylvain Guerber

  104
  Citations

• Requirements for ultra-thin-film devices and new materials for the CMOS roadmap

  C. Fenouillet-Beranger;T. Skotnicki;S. Monfray;N. Carriere

  101
  Citations

• Comprehensive and Accurate Parasitic Capacitance Models for Two- and Three-Dimensional CMOS Device Structures

  J. Lacord;G. Ghibaudo;F. Boeuf

  96
  Citations

• Ultra-thin-body and BOX (UTBB) fully depleted (FD) device integration for 22nm node and beyond

  Q. Liu;A. Yagishita;N. Loubet;A. Khakifirooz

  92
  Citations