1043-7398
Published by: The American Society of Mechanical Engineers (ASME)
| Discipline name | Position | Best Scientists | Publications | D-Index |
|---|---|---|---|---|
| Mechanical and Aerospace Engineering | 234 | 21 | 58 | 12 |
| Engineering and Technology | 905 | 12 | 28 | 9 |
Composite material, Stress (mechanics), Soldering, Structural engineering and Mechanical engineering are among the topics commonly tackled in Journal of Electronic Packaging. The journal investigates Composite material research which frequently intersects with Forensic engineering. It explores research in Stress (mechanics) and the adjacent study of Deformation (meteorology).
While Journal of Electronic Packaging focused on Soldering, it was also able to explore topics like Creep, Joint (geology) and Temperature cycling. In Journal of Electronic Packaging, Electronic packaging and Printed circuit board are investigated in conjunction with one another to address concerns in Structural engineering research. Topics in Mechanical engineering explored in it were investigated in conjunction with research in Reliability (semiconductor), Thermal, Heat transfer and Electronics.
It focuses on Heat transfer as well as the interrelated topic of Thermal conduction. The research on Heat sink featured in the journal combines topics in other fields like Plate fin heat exchanger and Micro heat exchanger. In the journal, researchers investigate the Thermal resistance study as part of research in the field of Mechanics.
The journal papers investigate studies in Composite material, Stress (mechanics), Soldering, Heat transfer and Structural engineering. The published articles explore research in Heat transfer alongside concepts in Heat sink and other areas of study in Thermal resistance, Plate fin heat exchanger and Micro heat exchanger. In addition to Structural engineering research, the journal publications aim to explore topics under Electronic packaging, Thermal and Printed circuit board.
The foci of the journal are Soldering, Mechanical engineering, Composite material, Nanoparticle and Structural engineering. Journal of Electronic Packaging holds forums on Soldering that merges themes from other disciplines such as Flexible electronics, Stress (mechanics), Printed circuit board and Pressure sensor. It addresses concerns in Mechanical engineering which are intertwined with other disciplines, such as Joint (geology), Soldering process, Wave soldering and Reliability (semiconductor).
While work presented in the journal provided substantial information on Composite material, it also covered topics in Spray cooling, Critical heat flux and Copper nanoparticle. Journal of Electronic Packaging focuses on Nanoparticle but the discussions also offer insight into other areas such as Ultimate tensile strength, Solder alloy, Microstructure, Full color and Contrast ratio. The Structural engineering research discussed in it can contribute to the expansion of the discourse in closely related subjects like
A key indicator for each journal is its effectiveness in reaching other researchers with the papers published at that venue.
The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.
The top authors publishing in Journal of Electronic Packaging (based on the number of publications) are:
The overall trend for top authors publishing in this journal is outlined below. The chart shows the number of publications at each edition of the journal for top authors.
Only papers with recognized affiliations are considered
The top affiliations publishing in Journal of Electronic Packaging (based on the number of publications) are:
The overall trend for top affiliations publishing in this journal is outlined below. The chart shows the number of publications at each edition of the journal for top affiliations.
The publication chance index shows the ratio of articles published by the best research institutions in the journal edition to all articles published within that journal. The best research institutions were selected based on the largest number of articles published during all editions of the journal.
The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.
During the most recent 2022 edition, 0.00% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 30.77% were posted by at least one author from the top 10 institutions publishing in the journal. Another 7.69% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 7.69% of all publications and 53.85% were from other institutions.
A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of journals they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same journal from year to year.
The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the journal in relation to all participants in a given year.
The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.
Our experience to innovation index was created to show a cross-section of the experience level of authors publishing in a journal. The index includes the authors publishing at the last edition of a journal, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).
The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:
The chart below illustrates experience levels of first authors in cases of publications with multiple authors.
Ruina Xu;Gaoyuan Wang;Peixue Jiang
(2022)John H. Lau
(2021)Yongtong Li;Liang Gong;Minghai Xu;Yogendra Joshi
(2021)Yupu Ma;Xiaobing Luo
(2020)Ki Wook Jung;Eunho Cho;Hyoungsoon Lee;Chirag Kharangate
(2020)Neil Dalal;Yuan Gu;Guang Chen;Daniel R. Hines
(2020)Pradeep Lall;Vishal Mehta;Jeff Suhling;Ken Blecker
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