1551-4897
Published by: International Microelectronics And Packaging Society
| Discipline name | Position | Best Scientists | Publications | D-Index |
|---|---|---|---|---|
| Electronics and Electrical Engineering | 553 | 5 | 4 | 2 |
Journal of microelectronics and electronic packaging is organized to address concerns in the fields of Electrical engineering, Electronic engineering, Composite material, Optoelectronics and Ceramic. The Electrical engineering study tackled is a key component of adjacent topics in the area of Microelectromechanical systems. The Electronic engineering works featured in it incorporate elements from Mechanical engineering, Reliability (semiconductor), Silicon and Integrated circuit.
Journal of microelectronics and electronic packaging focused on Integrated circuit research but expanded to cover Interconnection. Composite material research featured in the journal incorporates concerns from various other topics such as Die (integrated circuit) and Thermal. In addition to Optoelectronics research, Journal of microelectronics and electronic packaging aims to explore topics under Printed circuit board and Chip.
While work presented in the journal provided substantial information on Ceramic, it also covered topics in Dielectric and Permittivity. The research on Soldering tackled can also make contributions to studies in the areas of Temperature cycling and Flip chip. In the journal, Chip-scale package, Nanotechnology and Ball grid array are investigated in conjunction with one another to address concerns in Electronic packaging research.
The published articles investigate studies in Electronic engineering, Optoelectronics, Composite material, Wafer and Microelectromechanical systems. The published papers discuss concepts in Electronic packaging under Electronic engineering and how they intertwine with disciplines like Noise floor. The works on Optoelectronics tackled in the journal papers bring together disciplines like Fourier transform infrared spectroscopy, Fourier transform spectroscopy and Ceramic.
The main research concerns discussed in Journal of microelectronics and electronic packaging are Composite material, Optoelectronics, Chip, Temperature cycling and Power module. The journal explores Composite material concepts, specifically Soldering, Void (composites) and Surface finish but expands to research in Mode (statistics). The journal holds forums on Soldering that merges themes from other disciplines such as Shear strength, Microstructure and Lead (electronics).
It explores research in Electromigration and overlapping concepts in Thermal to expand the discourse in Optoelectronics. Topics in Chip were tackled in line with various other fields like Mechanical engineering and Automotive engineering. The concepts on Power module presented in it can also apply to other research fields, including Characterization (materials science), Epoxy and Reliability (semiconductor).
A key indicator for each journal is its effectiveness in reaching other researchers with the papers published at that venue.
The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.
The top authors publishing in Journal of microelectronics and electronic packaging (based on the number of publications) are:
The overall trend for top authors publishing in this journal is outlined below. The chart shows the number of publications at each edition of the journal for top authors.
Only papers with recognized affiliations are considered
The top affiliations publishing in Journal of microelectronics and electronic packaging (based on the number of publications) are:
The overall trend for top affiliations publishing in this journal is outlined below. The chart shows the number of publications at each edition of the journal for top affiliations.
The publication chance index shows the ratio of articles published by the best research institutions in the journal edition to all articles published within that journal. The best research institutions were selected based on the largest number of articles published during all editions of the journal.
The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.
During the most recent 2021 edition, 80.00% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 0.00% were posted by at least one author from the top 10 institutions publishing in the journal. Another 0.00% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 100.00% of all publications and 0.00% were from other institutions.
A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of journals they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same journal from year to year.
The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the journal in relation to all participants in a given year.
The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.
Our experience to innovation index was created to show a cross-section of the experience level of authors publishing in a journal. The index includes the authors publishing at the last edition of a journal, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).
The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:
The chart below illustrates experience levels of first authors in cases of publications with multiple authors.
Tzu-Hsuan Cheng;Kenji Nishiguchi;Yoshi Fukawa;B. Jayant Baliga
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