Conference dates: 10/16/2020 - 10/18/2020
| Discipline name | Position | Best Scientists | Publications | D-Index |
|---|---|---|---|---|
| Materials Science | 123 | 15 | 36 | 2 |
| Electronics and Electrical Engineering | 404 | 21 | 65 | 5 |
| Engineering and Technology | 125 | 12 | 45 | 5 |
The ranking presented on this page provides a comprehensive evaluation of scientific conferences in the field of Engineering and Technology. Developed by Research.com, a leading and reputable source for academic research data since 2014, this ranking draws upon an extensive dataset to deliver trusted insights into scientific excellence and impact across the discipline.
Each conference’s position in the ranking is determined by a unique bibliometric score, a metric devised by Research.com's team of experts. This score is calculated based on the estimated h-index as well as the number of leading scientists who have contributed to the conference over the past three years. The ranking incorporates Impact Score values collected on 2024-11-27 to ensure the most current and relevant assessment.
The methodology employed is distinguished by its depth and rigor. More than 2,262 conferences were carefully evaluated through a detailed examination of over 26,934 scientific documents published in the last three years. These publications were authored by 9,385 distinguished and respected scientists specializing in Engineering and Technology, reinforcing the integrity and breadth of the analysis.
Further information regarding the detailed methodology, including the specific metrics and evaluation processes used to compute the ranking scores, is available for review on our Methodology Page.
A key indicator for each conference is its effectiveness in reaching other researchers with the papers published at that venue.
The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.
The top authors publishing at IEEE International Conference on Applied Superconductivity and Electromagnetic Devices (based on the number of publications) are:
The overall trend for top authors publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top authors.
Only papers with recognized affiliations are considered
The top affiliations publishing at IEEE International Conference on Applied Superconductivity and Electromagnetic Devices (based on the number of publications) are:
The overall trend for top affiliations publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top affiliations.
The publication chance index shows the ratio of articles published by the best research institutions at the conference edition to all articles published within that conference. The best research institutions were selected based on the largest number of articles published during all editions of the conference.
The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.
During the most recent 2020 edition, 9.79% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 55.26% were posted by at least one author from the top 10 institutions publishing at the conference. Another 23.68% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 16.12% of all publications and 4.93% were from other institutions.
A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of conferences they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same conference from year to year.
The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the conference in relation to all participants in a given year.
The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.
Our experience to innovation index was created to show a cross-section of the experience level of authors publishing at a conference. The index includes the authors publishing at the last edition of a conference, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).
The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:
The chart below illustrates experience levels of first authors in cases of publications with multiple authors.
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University of Wollongong
South China University of Technology
Deakin University
University of Louisiana at Lafayette
University of Cambridge
Curtin University
University of Technology Sydney
Huazhong University of Science and Technology
University of Sydney
University of Wollongong
Jiangsu University
Jiangsu University
