| Discipline name | Position | Best Scientists | Publications | D-Index |
|---|---|---|---|---|
| Materials Science | 179 | 504 | 688 | 39 |
Vacuum aims to foster the development of research in Analytical chemistry, Thin film, Composite material, Metallurgy and Optoelectronics. It explores topics in Analytical chemistry which can be helpful for research in disciplines like Ion, Substrate (electronics), Plasma and Sputtering. While work presented in it provided substantial information on Ion, it also covered topics in Irradiation and Atomic physics.
While Vacuum focused on Atomic physics, it was also able to explore topics like Ionization and Electron. The research on Thin film featured in the journal combines topics in other fields like Amorphous solid, Annealing (metallurgy), Chemical engineering and Optics. It covers various topics on Composite material such as Microstructure and Coating.
Alloy is a major topic of Metallurgy research presented in the journal.
Analytical chemistry, Thin film, Metallurgy, Sputtering and Composite material are the main subjects of interest in the journal publications. Aside from discussions in Analytical chemistry, the journal publications also deal with the subject of Plasma which intersects with Atomic physics disciplines. While the published papers focused on Metallurgy, they were also able to explore topics like Layer (electronics) and Coating.
The primary areas of discussion in the journal are Composite material, Microstructure, Analytical chemistry, Alloy and Corrosion. While Composite material is the focus of Vacuum, it also provided insights into the studies of Thermal diffusivity, Spinodal decomposition and Ostwald ripening. Topics in Microstructure explored in the journal were investigated in conjunction with research in Nanocomposite, X-ray crystallography, Diffraction, Transmission electron microscopy and Laser.
It addresses concerns in Analytical chemistry which are intertwined with other disciplines, such as Decomposition, Drop (liquid), Pulse discharge, Ozone concentration and Ozone generator. The subject of Phase (matter), which is connected to the field of Solid solution, serves as the foundation of the Alloy research featured in Vacuum. Issues in Corrosion were discussed, taking into consideration concepts from other disciplines like Contact angle, Tin, Contact resistance, Sputter deposition and Nanocrystalline material.
A key indicator for each journal is its effectiveness in reaching other researchers with the papers published at that venue.
The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.
The top authors publishing in Vacuum (based on the number of publications) are:
The overall trend for top authors publishing in this journal is outlined below. The chart shows the number of publications at each edition of the journal for top authors.
Only papers with recognized affiliations are considered
The top affiliations publishing in Vacuum (based on the number of publications) are:
The overall trend for top affiliations publishing in this journal is outlined below. The chart shows the number of publications at each edition of the journal for top affiliations.
The publication chance index shows the ratio of articles published by the best research institutions in the journal edition to all articles published within that journal. The best research institutions were selected based on the largest number of articles published during all editions of the journal.
The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.
During the most recent 2022 edition, 9.09% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 10.00% were posted by at least one author from the top 10 institutions publishing in the journal. Another 0.00% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 40.00% of all publications and 50.00% were from other institutions.
A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of journals they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same journal from year to year.
The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the journal in relation to all participants in a given year.
The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.
Our experience to innovation index was created to show a cross-section of the experience level of authors publishing in a journal. The index includes the authors publishing at the last edition of a journal, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).
The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:
The chart below illustrates experience levels of first authors in cases of publications with multiple authors.
Suprimkumar D. Dhas;Parvejha S. Maldar;Meenal D. Patil;Amruta B. Nagare
(2020)Unknown
(2022)Mingliang Wang;Yiping Lu;Guojia Zhang;Hongzhi Cui
(2021)Y. Pan;D.L. Pu;E.D. Yu
(2021)I.S. Okeke;K.K. Agwu;A.A. Ubachukwu;I.G. Madiba;I.G. Madiba
(2021)Yong Pan;Jin Zhang
(2021)Yong Pan;Delin Pu;Gaihua Liu
(2020)Martin Magnuson;Lars Hultman;Hans Högberg
(2021)Yong Pan;Yuanhua Lin;Gaihua Liu;Jin Zhang
(2020)Yong Pan;Delin Pu;Yanlin Jia;Yanlin Jia
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