0954-0911
Published by: Emerald Publishing
http://emeraldgrouppublishing.com/products/journals/journals.htm?id=SSMT
| Discipline name | Position | Best Scientists | Publications | D-Index |
|---|---|---|---|---|
| Materials Science | 820 | 6 | 6 | 3 |
The topics of Soldering, Composite material, Metallurgy, Printed circuit board and Solder paste are the focal point of discussions in Soldering & Surface Mount Technology. Reflow soldering is a primary topic of Soldering research in the journal. While Composite material is the key highlight in the journal, it also covered some subjects on Temperature cycling and Ceramic.
Soldering & Surface Mount Technology focuses on Metallurgy research which is adjacent to topics in Wetting. While work presented in Soldering & Surface Mount Technology provided substantial information on Wetting, it also covered topics in Contact angle, Flux (metallurgy) and Solderability. The concepts on Printed circuit board presented in the journal can also apply to other research fields, including Electronic engineering and Ball grid array.
Issues in Solder paste were discussed, taking into consideration concepts from other disciplines like Stencil printing and Stencil. Engineering drawing and Electronics are some topics wherein Mechanical engineering research discussed in the journal have an impact. Some problems in Flip chip that were presented in Soldering & Surface Mount Technology overlapped with concepts under Electronic packaging and Adhesive.
The journal publications tackle a plethora of topics, such as Soldering, Metallurgy, Composite material, Microstructure and Intermetallic. Solder paste is a focus of the presented Soldering works in the most cited publications and they dives deep in Solder paste. The most cited publications explore issues in Metallurgy which can be linked to other research areas like Wetting, Melting point and Scanning electron microscope.
The foci of Soldering & Surface Mount Technology are Soldering, Composite material, Microstructure, Reliability (semiconductor) and Metallurgy. In Soldering & Surface Mount Technology, Mechanical engineering, Artificial intelligence and Intermetallic are investigated in conjunction with one another to address concerns in Soldering research. The journal explores research in Composite material and the adjacent study of Surface (mathematics).
Soldering & Surface Mount Technology focuses on Microstructure but the discussions also offer insight into other areas such as Ultimate tensile strength, Ultrasonic soldering, Microwave and Susceptor. Reliability (semiconductor) research presented in it encompasses a variety of subjects, including Interconnection, Temperature cycling, Chip and Microelectronics. The study of Thermal and how it intertwines with concepts under Eutectic system were explored in the presented Metallurgy research.
A key indicator for each journal is its effectiveness in reaching other researchers with the papers published at that venue.
The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.
The top authors publishing in Soldering & Surface Mount Technology (based on the number of publications) are:
The overall trend for top authors publishing in this journal is outlined below. The chart shows the number of publications at each edition of the journal for top authors.
Only papers with recognized affiliations are considered
The top affiliations publishing in Soldering & Surface Mount Technology (based on the number of publications) are:
The overall trend for top affiliations publishing in this journal is outlined below. The chart shows the number of publications at each edition of the journal for top affiliations.
The publication chance index shows the ratio of articles published by the best research institutions in the journal edition to all articles published within that journal. The best research institutions were selected based on the largest number of articles published during all editions of the journal.
The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.
During the most recent 2021 edition, 100.00% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, nan% were posted by at least one author from the top 10 institutions publishing in the journal. Another nan% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included nan% of all publications and nan% were from other institutions.
A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of journals they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same journal from year to year.
The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the journal in relation to all participants in a given year.
The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.
Our experience to innovation index was created to show a cross-section of the experience level of authors publishing in a journal. The index includes the authors publishing at the last edition of a journal, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).
The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:
The chart below illustrates experience levels of first authors in cases of publications with multiple authors.
Rafael Kakitani;Cassio Augusto Pinto da Silva;Bismarck Silva;Amauri Garcia
(2021)Guang Ren;Maurice Collins
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