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IEEE Transactions on Dielectrics and Electrical Insulation
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IEEE Transactions on Dielectrics and Electrical Insulation

Ranking & Metrics

Discipline name Position Best Scientists Publications D-Index
Electronics and Electrical Engineering 159 58 189 22
Engineering and Technology 534 23 94 16

Additional Metrics

Number of Best Scientists*: 162
Documents by Best Scientists*: 408
Top 100 Ranked Scientists*: 3
SCIMAGO H-index: 150
SCIMAGO SJR: 0.959
Impact Factor: 3.1

Overview

Top Research Topics at IEEE Transactions on Dielectrics and Electrical Insulation?

IEEE Transactions on Dielectrics and Electrical Insulation is organized to address concerns in the fields of Composite material, Voltage, Dielectric, Electrical engineering and Electric field. In the Composite material research discussed, Epoxy, Silicone rubber, Nanocomposite, Polymer and Insulator (electricity) are all tackled. Impulse (physics), Mechanics and Electrode are some topics wherein Voltage research discussed in it have an impact.

The work on Dielectric tackled in it brings together disciplines like Conductivity and Analytical chemistry. The in-depth study on Electrical engineering also explores topics in the intersecting field of Optoelectronics. Electric field research featured in IEEE Transactions on Dielectrics and Electrical Insulation incorporates concerns from various other topics such as Charge density, Field (physics), Space charge, Condensed matter physics and Surface charge.

The research on Space charge featured in IEEE Transactions on Dielectrics and Electrical Insulation combines topics in other fields like Charge (physics) and Polyethylene. The journal explores issues in Partial discharge which can be linked to other research areas like Acoustics and Electronic engineering. The research on Electronic engineering discussed in it draws on the closely related field of Transformer.

  • Composite material (28.42%)
  • Voltage (23.65%)
  • Dielectric (20.81%)

What are the most cited papers published in the journal?

  • Proposal of a multi-core model for polymer nanocomposite dielectrics (841 citations)
  • Dielectric nanocomposites with insulating properties (812 citations)
  • Polymer nanocomposites as dielectrics and electrical insulation-perspectives for processing technologies, material characterization and future applications (765 citations)

Research areas of the most cited articles at IEEE Transactions on Dielectrics and Electrical Insulation:

The most cited publications generally zeroe in on subjects such as Composite material, Dielectric, Electronic engineering, Analytical chemistry and Voltage. Issues in Dielectric were discussed in the most cited articles, taking into consideration concepts from other disciplines like Space charge and Transformer oil. The studies on Electronic engineering discussed at the most cited publications can also contribute to research in the domains of Partial discharge, Transformer and Condition monitoring.

What topics the last edition of the journal is best known for?

  • Quantum mechanics
  • Composite material
  • Organic chemistry

The previous edition focused in particular on these issues:

The topics of Composite material, Electric field, Voltage, Dielectric and Space charge are the focal point of discussions in IEEE Transactions on Dielectrics and Electrical Insulation. The Composite material works featured in it incorporate elements from Partial discharge and Conductivity. The work on Electric field tackled in IEEE Transactions on Dielectrics and Electrical Insulation brings together disciplines like Charge density, Field (physics), Condensed matter physics, Electrode and Surface charge.

Impulse (physics), Mechanics and Current (fluid) are some topics wherein Voltage research discussed in it have an impact. The journal explores topics in Dielectric which can be helpful for research in disciplines like Chemical engineering and Capacitor. While Breakdown voltage is the focus of it, it also provided insights into the studies of Sulfur hexafluoride and Analytical chemistry.

The most cited articles from the last journal are:

  • Applications of the Acoustic Method in Partial Discharge Measurement: A Review (6 citations)
  • Insulation Materials and Systems for Power Electronics Modules: A Review Identifying Challenges and Future Research Needs (6 citations)
  • High Temperature Insulation Materials for DC Cable Insulation — Part I: Space Charge and Conduction (6 citations)

Papers citation over time

A key indicator for each journal is its effectiveness in reaching other researchers with the papers published at that venue.

The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.

The top authors publishing in IEEE Transactions on Dielectrics and Electrical Insulation (based on the number of publications) are:

  • Boxue Du (140 papers) published 8 papers at the last edition, 6 less than at the previous edition,
  • Shigemitsu Okabe (103 papers) absent at the last edition,
  • Hitoshi Okubo (77 papers) published 1 paper at the last edition,
  • Shengtao Li (75 papers) published 3 papers at the last edition, 3 less than at the previous edition,
  • George Chen (72 papers) absent at the last edition.

The overall trend for top authors publishing in this journal is outlined below. The chart shows the number of publications at each edition of the journal for top authors.

Only papers with recognized affiliations are considered

The top affiliations publishing in IEEE Transactions on Dielectrics and Electrical Insulation (based on the number of publications) are:

  • Xi'an Jiaotong University (409 papers) published 24 papers at the last edition, 21 less than at the previous edition,
  • Chongqing University (235 papers) published 14 papers at the last edition, 4 less than at the previous edition,
  • Electric Power Research Institute (225 papers) published 11 papers at the last edition, 6 less than at the previous edition,
  • Tsinghua University (207 papers) published 9 papers at the last edition, 4 less than at the previous edition,
  • Tianjin University (146 papers) published 9 papers at the last edition, 8 less than at the previous edition.

The overall trend for top affiliations publishing in this journal is outlined below. The chart shows the number of publications at each edition of the journal for top affiliations.

Publication chance based on affiliation

The publication chance index shows the ratio of articles published by the best research institutions in the journal edition to all articles published within that journal. The best research institutions were selected based on the largest number of articles published during all editions of the journal.

The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.

During the most recent 2021 edition, 5.56% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 46.47% were posted by at least one author from the top 10 institutions publishing in the journal. Another 13.53% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 14.71% of all publications and 25.29% were from other institutions.

Returning Authors Index

A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of journals they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same journal from year to year.

The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the journal in relation to all participants in a given year.

Returning Institution Index

The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.

The experience to innovation index

Our experience to innovation index was created to show a cross-section of the experience level of authors publishing in a journal. The index includes the authors publishing at the last edition of a journal, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).

The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:

  • Novice - P < 5 or C < 25 (the number of publications less than 5 or the number of citations less than 25),
  • Competent - P < 10 or C < 100 (the number of publications less than 10 or the number of citations less than 100),
  • Experienced - P < 25 or C < 625 (the number of publications less than 25 or the number of citations less than 625),
  • Master - P < 50 or C < 2500 (the number of publications less than 50 or the number of citations less than 2500),
  • Star - P ≥ 50 and C ≥ 2500 (both the number of publications greater than 50 and the number of citations greater than 2500).

The chart below illustrates experience levels of first authors in cases of publications with multiple authors.

Top Publications

  • Condition Monitoring Based on Partial Discharge Diagnostics Using Machine Learning Methods: A Comprehensive State-of-the-Art Review

    Shibo Lu;Hua Chai;Animesh Sahoo;B. T. Phung

    (2020)
    215 Citations
  • Polyimide films coated by magnetron sputtered boron nitride for high-temperature capacitor dielectrics

    Sang Cheng;Yao Zhou;Jun Hu;Jinliang He

    (2020)
    90 Citations
  • Optimal ratio limits of rogers' four-ratios and IEC 60599 code methods using particle swarm optimization fuzzy-logic approach

    Ibrahim B. M. Taha;Ayman Hoballah;Sherif S. M. Ghoneim

    (2020)
    82 Citations
  • A review on pre-breakdown phenomena in ester fluids: Prepared by the international study group of IEEE DEIS liquid dielectrics technical committee

    U. Mohan Rao;I. Fofana;A. Beroual;P. Rozga

    (2020)
    65 Citations
  • Nano-BN encapsulated micro-AlN as fillers for epoxy composites with high thermal conductivity and sufficient dielectric breakdown strength

    Tong Yao;Ke Chen;Tao Shao;Cheng Zhang

    (2020)
    59 Citations
  • SF 6 fault decomposition feature component extraction and triangle fault diagnosis method

    Fuping Zeng;Siying Wu;Zhicheng Lei;Chen Li

    (2020)
    56 Citations
  • Understanding Partial Discharge Behavior from the Memory Effect Induced by Residual Charges: A Review

    Cheng Pan;Kai Wu;George Chen;Yu Gao

    (2020)
    51 Citations
  • Compatibility dependent space charge accumulation behavior of polypropylene/elastomer blend for HVDC cable insulation

    Yu Gao;Jing Li;George Chen;Tao Han

    (2020)
    48 Citations

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