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IEEE

6th International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2026) (3D-PEIM)

Location: Arizona State University, Tempe, AZ, USA , United States

Conference dates: 11/16/2026 - 11/19/2026

Research H-index
7

Ranking & Metrics

Discipline name Position Best Scientists Publications D-Index
Materials Science 57 3 4 2
Electronics and Electrical Engineering 283 10 14 7

Call for Papers

3D-PEIM is an IEEE EPS symposium on 3D power-electronics integration. 3D-PEIM 2026 covers advanced packaging and integration, wide-bandgap power modules, thermal management, and manufacturing for high-density power electronics.

Best Scientists who published in this Conference

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