TEI 2027 — 21st ACM International Conference on Tangible, Embedded, and Embodied Interaction (TEI)

TEI is the annual ACM SIGCHI conference on tangible, embedded and embodied interaction. It invites original contributions on tangible interfaces, embodied interaction, physical computing, wearables, shape-changing interfaces, digital fabrication, interaction design, arts and crafts. Submissions may take the form of full research papers, extended abstracts and poster presentations reporting theoretical, computational and experimental work, as well as industrial case studies and applications. The meeting brings together researchers, engineers, industry practitioners and students to exchange recent results and discuss emerging directions in the field. Accepted papers are published in the conference proceedings (ACM).