IWIPP 2027 — IEEE International Workshop on Integrated Power Packaging (IWIPP)

IWIPP is the IEEE PELS/EPS workshop on packaging and integration of power electronics, held roughly every two years. It invites original contributions on power module packaging, wide-bandgap device packaging, passive component integration, electrical insulation materials, thermal management, reliability, high-density converters. Submissions may take the form of full research papers, extended abstracts and poster presentations reporting theoretical, computational and experimental work, as well as industrial case studies and applications. The meeting brings together researchers, engineers, industry practitioners and students to exchange recent results and discuss emerging directions in the field. Accepted papers are published in the conference proceedings and submitted to IEEE Xplore.