Applied Materials (United States)
His primary scientific interests are in Optoelectronics, Analytical chemistry, Layer, Dielectric and Silicon oxide. His work on Semiconductor and Integrated circuit as part of general Optoelectronics study is frequently linked to Electric field, bridging the gap between disciplines. His study in Analytical chemistry is interdisciplinary in nature, drawing from both Substrate and Chemical vapor deposition.
His Layer research integrates issues from Inorganic chemistry, Mixing, Silicon and Nitrogen. His Dielectric research focuses on Composite material and how it connects with Oxygen content. His Silicon oxide study introduces a deeper knowledge of Substrate.
His scientific interests lie mostly in Optoelectronics, Silicon oxide, Substrate, Dielectric and Layer. The study incorporates disciplines such as Trench, Substrate and Analytical chemistry in addition to Optoelectronics. His Silicon oxide study incorporates themes from Inorganic chemistry, Dry etching and Oxide thin-film transistor.
His Substrate research incorporates themes from Silicon nitride, Thin film, Silicon carbide, Etching and Chemical engineering. His research in Dielectric intersects with topics in Organosilicon, Nanotechnology, Carbon, Deposition and Shallow trench isolation. The various areas that he examines in his Layer study include Organic compound, Mixing, Electronic engineering and Silicon.
Shankar Venkataraman spends much of his time researching Remote plasma, Optoelectronics, Etching, Wafer and Cathode. Remote plasma connects with themes related to Analytical chemistry in his study. His Optoelectronics research includes elements of Oxide and Shallow trench isolation.
Shankar Venkataraman interconnects Substrate and Substrate in the investigation of issues within Etching. He studies Substrate, namely Silicon oxide. His Silicon oxide research is multidisciplinary, incorporating perspectives in Inorganic chemistry and Excitation.
Shankar Venkataraman mainly investigates Remote plasma, Etching, Electronic engineering, Chemical engineering and Substrate. The Remote plasma study combines topics in areas such as Substrate, Patterned substrate and Analytical chemistry. His research integrates issues of Process engineering, Insert, Semiconductor and Process in his study of Electronic engineering.
His study in Chemical engineering is interdisciplinary in nature, drawing from both Silicon nitride, Silicon, Silicon oxide and Nanotechnology. His Substrate research integrates issues from Inorganic chemistry, Excitation and Doping.
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Integration of remote plasma generator with semiconductor processing chamber
Janakiraman Karthik;Fong Kelly;Chen Chen-An;Le Paul.
Accelerated plasma clean
Shankar N. Chandran;Scott Hendrickson;Gwendolyn D. Jones;Shankar Venkataraman.
Semiconductor processing system and methods using capacitively coupled plasma
Jang-Gyoo Yang;Matthew L. Miller;Xinglong Chen;Kien N. Chuc.
Formation of a liquid-like silica layer by reaction of an organosilicon compound and a hydroxyl forming compound
David W Cheung;Frederick Gaillard;Shin-Puu Jeng;Chi-I Lang.
Semiconductor processing systems having multiple plasma configurations
드미트리 루보미르스키;싱롱 첸;샨카르 벤카타라만.
Method of depositing dielectric materials in damascene applications
Ju-hyung Lee;Ping Xu;Shankar Venkataraman;Li-Qun Xia.
Formation of silicon oxide using non-carbon flowable cvd processes
Jingmei Liang;Nitin K. Ingle;Shankar Venkataraman.
Method of depositing low dielectric constant silicon carbide layers
Francimar Campana;Srinivas Nemani;Michael Chapin;Shankar Venkataraman.
Method and apparatus for cleaning a cvd chamber
Maosheng Zhao;Juan Carlos Rocha-Alvarez;Inna Shmurun;Soova Sen.
Processing systems and methods for halide scavenging
Wang Anchuan;Chen Xinglong;Li Zihui;Hamana Hiroshi.
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