Special Issue Information Special Issue Call for Paper Other Special Issues on this journal Closed Special Issues
Design methodologies and tools for Integrated 5G/6G technologies and their applications

Design methodologies and tools for Integrated 5G/6G technologies and their applications

Journal
Impact Score 2.97

OFFICIAL WEBSITE

Special Issue Information

Submission Deadline: 15-06-2021
Journal Impact Score: 2.97
Journal Name: Microprocessors and Microsystems
Publisher: Microprocessors and Microsystems

Special Issue Call for Papers


Embedded electronic systems contain a combination of software and hardware, both analog and digital. Although simple systems can be implemented with a single, off the-shelf microcontroller, a digital signal processor or a conventional microprocessor and associated software, more complex systems that have critical requirements regarding aspects such as area, speed, and power consumption call for innovative design. Various target architectures can be considered for matching different requirements. Solutions may include dedicated processors and/or ASICs, or even multi-processor platforms, combined with dedicated analog and RF front ends. The design of such complex embedded systems and analog front ends encompasses a suite of different technologies, tools, and design styles. A complete design environment must consider system specification, partitioning among software, digital hardware and analog parts, and synthesis of software and hardware parts and interfaces.



As the penetration of internet-based services such as video streaming, broadband connections have become an increasingly indispensable element of modern life, so the demand for advanced network technologies is growing stronger than ever. The dynamic 5G technology is one such concept anticipated to make a significant mark over the coming years. Indeed, it has resulted in the evolution and advancement of several verticals such as 5G chipsets, 5G enterprises, 5G broadcast, and more.



Defined with faster speed, increased bandwidth, higher capacity and low latency issues, 5G is likely to contribute to the several technological breakthroughs in fields ranging from smartphones and IoT connected devices to smart cities and autonomous cars. An important consideration in the growth of this technology is the establishment of a robust 5G infrastructure. 5G chipsets are an integral part of this infrastructure, which is why several vendors across the technological domain are showing a strong commitment towards developing sophisticated chipset solutions. 5G chipsets refer to a set of electronic elements within integrated 5G circuits, which facilitate the transmission of 5G packets on IoT devices, smartphones, portable hotspots, and even mobile network-equipped notebook PCs.



6G will eventually replace 5G, but currently 6G is not a mature technology, and is instead in the early research phase. Mobile telecoms companies are much too focused on 5G to deal with 6G in any significant way at the moment, and for the near future.



In this context, this special issue offers a platform for researchers and practitioners worldwide to present their novel and innovative ideas on design methodologies for integrated 5G/6G technologies. We invite unpublished articles presenting interactive system models, conceptual designs, and technological advancements related to the theme of this special issue.



Potential topics included, but not limited




 



 



Important Dates:



Last date for paper submission: 15 June 2021



First decision (Accept/ Revise): 15 August 2021



Revised submission due date: 30 October 2021



Final decision: 30 December 2021



 



Guest Editors:



Prof. Dr. Hamid Reza Karimi



Politecnico di Milano



Department of Mechanical Engineering
via La Masa 1, 20156 Milan, Italy



Email: [email protected]



Google scholar citations : https://scholar.google.co.in/citations?user=YcTS0ZMAAAAJ&hl=en



 



Prof. Dr. Jari Nurmi



Tampere University



Electrical Engineering Unit



Korkeakoulunkatu 1, 33014 Tampere University



Finland



Email: [email protected]



Webpage : https://www.tuni.fi/en/jari-nurmi



 



Dr. Houbing Song



Department of Electrical Engineering and Computer Science



Embry Riddle Aeronautical University, Florida, United States



Email: [email protected]



Webpage : https://faculty.erau.edu/Houbing.Song



Google scholar citations : https://scholar.google.com/citations?user=iJ_XxxoAAAAJ&hl=en



 



Dr.Harikrishnan Ramiah



Associate Professor of Electrical Engineering, University of Malaysia Malaysia,



Email : [email protected]



Google scholar citations : https://scholar.google.com/citations?user=PJXJbm4AAAAJ&hl=en



 



Dr. G.Kavithaa (Managing Guest Editor)



Assistant Professor



Department of Electronics and Communication Engineering



Government College of Engineering, Salem, India.



Email : [email protected][email protected]



https://gcesalem.edu.in/?q=users/gkavitha\

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