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The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems 2021

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems 2021

San Diego, United States

Submission Deadline: Monday 06 Sep 2021

Conference Dates: May 31, 2022 - Jun 03, 2022

Research
Impact Score 1.20

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Ranking & Metrics Impact Score is a novel metric devised to rank conferences based on the number of contributing the best scientists in addition to the h-index estimated from the scientific papers published by the best scientists. See more details on our methodology page.

Research Impact Score: 1.20
Contributing Best Scientists: 29
H5-index:
Papers published by Best Scientists 37
Research Ranking (Electronics and Electrical Engineering) 435
Research Ranking (Mechanical and Aerospace Engineering) 29
Research Ranking (Materials Science) 29

Conference Call for Papers

Requirements for Paper
Draft papers must be submitted in PDF format. For final papers, both PDF and MS Word (.docx or .doc file) should be submitted (unless you use LaTex). In all cases, use the specific dimensions indicated in the paper template, and create the PDF from that document for submission. IEEE compliance of submitted papers will be checked before they can appear in the conference proceedings and IEEE Explore database.
We expect papers to be between 5 and 8 pages, but a bit longer is acceptable. Please do not exceed 10 pages.
Please download the ITherm Conference format specifications and MS Word template. These will be needed as you prepare your full paper for submission.
ITherm uses the IEEE Cross Check plagiarism-checking system. This system identifies issues including sections of your paper that are substantially the same as one of your earlier papers, or sections have been copied from another published paper by other authors or from the Internet. IEEE has a strict approach to both using your own previously published material (self-plagiarism), as well as copying from other's works. When you find it useful to quote other papers, please place a citation in your References, and summarize the other material rather than copying it word for word into your own paper.
For the final paper upload for publication in the conference proceedings, papers should be 5-8 pages in length. Both files, the .docx or .doc (source) and the PDF, in the conference format should be submitted. If necessary, the submitted .docx file will be used to correct any minor formatting issues and add page numbers to the final paper.
At least one of the authors listed on the paper must register for ITherm 2020 at the full member/non-member rate at the time of uploading the final manuscript, except for student papers, when a student registration is allowed. One author for each paper must be registered by April 5, 2021.

Overview

Top Research Topics at Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems?

  • Heat transfer (23.61%)
  • Mechanical engineering (22.04%)
  • Composite material (20.00%)

The foci of the conference are Heat transfer, Mechanical engineering, Composite material, Thermal resistance and Heat sink. Studies on Heat transfer tackled in it are critical in grasping new concepts in the fields of Mechanics and Thermodynamics. The event holds forums on Mechanical engineering that merges themes from other disciplines such as Finite element method and Electronics.

Soldering, Stress (mechanics), Flip chip and Electronic packaging are all aspects of Composite material discussed in Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems focuses on Soldering but the discussions also offer insight into other areas such as Creep, Structural engineering and Temperature cycling. The conference explores topics in Thermal resistance which can be helpful for research in disciplines like Thermal conductivity, Thermal grease, Electronic engineering and Electrical engineering.

The research on Electronic engineering tackled can also make contributions to studies in the areas of Die (integrated circuit), Integrated circuit packaging, Chip, Optoelectronics and Printed circuit board. In addition to Heat sink research, the conference aims to explore topics under Fin (extended surface), Microchannel, Air cooling and Heat pipe. The Thermal works, particularly on Thermal analysis are tackled in the conference.

What are the most cited papers published at the conference?

  • Thermal considerations in cooling large scale high compute density data centers (195 citations)
  • Moisture absorption and desorption predictions for plastic ball grid array packages (173 citations)
  • Dynamic thermal management of air cooled data centers (172 citations)

Research areas of the most cited articles at Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems:

The conference publications aim to foster the development of research in Mechanical engineering, Heat transfer, Heat sink, Thermal resistance and Mechanics. Issues in Mechanical engineering were discussed in the conference articles, taking into consideration concepts from other disciplines like Thermal, Data center and Chiller. The works on Thermal resistance tackled in the most cited articles bring together disciplines like Thermal conductivity, Thermal grease, Thermal conduction, Electronic engineering and Electrical engineering.

Papers citation over time

A key indicator for each conference is its effectiveness in reaching other researchers with the papers published at that venue.

The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.

Research.com

The top authors publishing at Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (based on the number of publications) are:

  • Pradeep Lall (34 papers) published 18 papers at the last edition, 9 more than at the previous edition,
  • Bahgat Sammakia (30 papers) published 4 papers at the last edition, 4 less than at the previous edition,
  • Jeffrey C. Suhling (26 papers) published 12 papers at the last edition, 5 more than at the previous edition,
  • Yogendra Joshi (26 papers) published 10 papers at the last edition, 3 more than at the previous edition,
  • Ganesh Subbarayan (17 papers) published 3 papers at the last edition the same number as at the previous edition.

The overall trend for top authors publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top authors.

Research.com

Only papers with recognized affiliations are considered

The top affiliations publishing at Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (based on the number of publications) are:

  • IBM (53 papers) published 16 papers at the last edition, 5 more than at the previous edition,
  • Purdue University (47 papers) published 11 papers at the last edition, 3 more than at the previous edition,
  • Georgia Institute of Technology (44 papers) published 18 papers at the last edition, 9 more than at the previous edition,
  • Binghamton University (37 papers) published 5 papers at the last edition, 8 less than at the previous edition,
  • Auburn University (36 papers) published 16 papers at the last edition, 5 more than at the previous edition.

The overall trend for top affiliations publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top affiliations.

Research.com

Publication chance based on affiliation

The publication chance index shows the ratio of articles published by the best research institutions at the conference edition to all articles published within that conference. The best research institutions were selected based on the largest number of articles published during all editions of the conference.

The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.

Research.com

During the most recent 2016 edition, 5.96% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 40.49% were posted by at least one author from the top 10 institutions publishing at the conference. Another 11.71% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 16.10% of all publications and 31.71% were from other institutions.

Returning Authors Index

A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of conferences they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same conference from year to year.

The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the conference in relation to all participants in a given year.

Research.com

Returning Institution Index

The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.

Research.com

The experience to innovation index

Our experience to innovation index was created to show a cross-section of the experience level of authors publishing at a conference. The index includes the authors publishing at the last edition of a conference, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).

The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:

  • Novice - P < 5 or C < 25 (the number of publications less than 5 or the number of citations less than 25),
  • Competent - P < 10 or C < 100 (the number of publications less than 10 or the number of citations less than 100),
  • Experienced - P < 25 or C < 625 (the number of publications less than 25 or the number of citations less than 625),
  • Master - P < 50 or C < 2500 (the number of publications less than 50 or the number of citations less than 2500),
  • Star - P ≥ 50 and C ≥ 2500 (both the number of publications greater than 50 and the number of citations greater than 2500).

Research.com

The chart below illustrates experience levels of first authors in cases of publications with multiple authors.

Research.com

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Previous Editions

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