Ranking & Metrics Conference Call for Papers Other Conferences in United States
Optical Interconnects

Optical Interconnects

San Francisco, United States

Submission Deadline: Wednesday 20 Jul 2022

Conference Dates: Jan 28, 2023 - Feb 02, 2023

Research
Impact Score 0.70

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Ranking & Metrics Impact Score is a novel metric devised to rank conferences based on the number of contributing the best scientists in addition to the h-index estimated from the scientific papers published by the best scientists. See more details on our methodology page.

Research Impact Score: 0.70
Contributing Best Scientists: 4
H5-index:
Papers published by Best Scientists 5
Research Ranking (Electronics and Electrical Engineering) 476

Conference Call for Papers

Papers are solicited in the following areas:

PIC integration and optical coupling
silicon photonics, SiN, Ge, SiGe, III-V device integration
Integrated Quantum Photonics, Quantum PIC (QPIC) Integration
small size and low loss waveguide-based active and passive devices
heterogeneous and monolithic device integration including silicon photonics
advances in chip-to-waveguide or chip-to-fiber coupling schemes including: grating coupler, adiabatic taper, and butt-coupling approaches
2D membrane-based devices
photonic crystals and surface plasmonic waveguides for interconnect applications
new regimes involving surface plasmons or optical polaritons
implementation of optical interconnects in Si CMOS process compatible environment
measurement and testing methods for hybrid electronic/photonic assemblies
reliability assessment of optical interconnects, sub-systems, and electronic/photonic assemblies
foundry service explorations for new PDK and PAK comprehensive library formation
packaging density enhancement of integrated photonic devices.
Parallel optical link module technologies
single-mode conversion in data centers
data communication systems with parallel optical links and active optical cables
integration and packaging technologies for parallel on-board transceivers, co-packaging
optical bus architectures for on-board interconnects
ultra-low cost and ultra-low power optical links using novel laser and photodiode array components for interconnect applications
fiber optical connectors and coupling approaches
assembly and alignment of arrayed components
free-space parallel optical interconnect
mid-IR optical interconnects for free space communications and sensing
room temperature MidIR QCLs, QCDs, ICLs, ICDs and APDs
massively distributed optical interconnects suitable for neuromorphic optical computing.
Optical communications, sensing, and computing in next-generation systems
optical interconnect solutions and packaging for quantum communication, sensing, and quantum computing
advanced photonic integration technologies for computer-com applications
rack- and enclosure scale disaggregation
optically enabled hyperconverged infrastructures
multi-tier optical connectivity
optical packet and circuit switch technologies and architectures for data centers
WDM and SDM switching technologies and architectures for intra-data center interconnections
power-efficient optical computing for data centers
future demands for parallel optics in data center: inter-rack, inter-board, and inter-chip
digital and analog optical computing
latency and power reductions in optical computing
system miniaturization for quantum computing, communication, and sensing
implementation timeline for integrated photonics road mapping.
Micro-optic assembly and hybrid photonic microsystem manufacturing
micro-optic component assemblies and integrated micro-optics
3D optical routing and assembly of coupling elements
new connectors and novel light coupling approaches
quantum sensor integration, NV cells, and atom trap devices
prototyping for advanced interconnect fabrication
new fiber optical integration/coupling/connectorization techniques
fiber handling
advanced micro–optic components, holograms, gratings, and aspherical lenses
reflective, refractive, and diffractive micro-optic elements and micro-optical systems
active optical alignment and assembly automation
passive micro-optic alignment techniques
metamaterial for innovative micro- and nano-optical components
solder reflow compatible connectivity
interconnect reliability, qualification, and test
multimode fiber for single mode optical biosensing systems including coronavirus detection.
Substrate-based optical interconnect technologies
photonic substrate packaging and embedding for optoelectronic and micro-optical components
optical interconnect design and system architectures, end-to-end link modelling and simulation
electronic/photonic printed circuit boards and optical backplanes, panel level integration of photonics
optical waveguide, substrate guided, flexible, lay-in fiber, and free space optical interconnects
machine-to-machine, board-to-board, chip-to-chip, intra-chip optical interconnects
silicon/glass/silicon nitride/polymer based photonic interposer
heterogeneous integration on chip/chipled-level using photonic short reach interconnects (polymer/glass/SiN)
trends in ultra-short reach optical links
additive manufacturing and 3D-writing of optical interconnects
laser structuring of optical waveguides and interfaces in glass and polymer.
Materials for photonic packaging and interconnects
advanced photonics packaging materials
thin glass for board, modules, and panel-level-packaging
polymers and organic/inorganic hybrid materials for optical interconnects
novel nanostructures and nanotechnologies for optical interconnects
AuSn bonding for flip-chip with highest precision
structured fibers, multicore fibers and other novel optical fibers
integrated meta-material applications
nanomaterials and applications
novel bonding materials and processes
meta material for photonic packaging and interconnects

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Previous Editions

Optical Interconnects XXII

Jan 25, 2022 - Jan 27, 2022

San Francisco, California, United States

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