International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Name: International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Start: 2023-10-24T00:00:00+00:00
End: 2023-10-26T00:00:00+00:00
Location: San Diego

San Diego, United States

Submission Deadline: Monday 27 Feb 2023

Conference Dates: Oct 24, 2023 - Oct 26, 2023

Research
Impact Score 0.40

OFFICIAL WEBSITE

Conference Organizers: Deadline extended?
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Research Impact Score: 0.40

Contributing Best Scientists: 4

H5-index:

Papers published by Best Scientists 8

Research Ranking (Electronics and Electrical Engineering) 659

Research Ranking (Mechanical and Aerospace Engineering) 106

Research Ranking (Materials Science) 173

Conference Call for Papers

nterPACK 2023 Tracks:
Heterogeneous Integration
Data Centers and Modular Edge Systems
Electronics Packaging
Power/RF Electronics and Photonics
Multiscale Thermal Transport and Energy Storage
Flexible, Wearable, and Printed Electronics
Transportation Systems, AI and Machine Learning
Interactive Presentations
Track 9: Panels, Tutorials, and Workshops