Ranking & Metrics Conference Call for Papers Other Conferences in United States
IEEE International 3D System Integration Conference

IEEE International 3D System Integration Conference

Cork , Ireland

Conference Dates: Dec 07, 2022 - Dec 09, 2022

Research
Impact Score 0.30

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Ranking & Metrics Impact Score is a novel metric devised to rank conferences based on the number of contributing the best scientists in addition to the h-index estimated from the scientific papers published by the best scientists. See more details on our methodology page.

Research Impact Score: 0.30
Contributing Best Scientists: 6
H5-index:
Papers published by Best Scientists 6
Research Ranking (Electronics and Electrical Engineering) 719

Conference Call for Papers

So much has changed since the first 3DIC conference in 2010! 3D integrated circuits have moved from academic curiosity to solid commercial reality. The underlying technologies continually improve and evolve, incorporating new methods and resources. Today’s hot topics include chiplets, photonic interconnect, micro-die handling, and exotic substrates. This 2022 conference will focus on the research and science of 3DICs. It will cover relevant 2.5D/3D topics from manufacturing, processes, materials, and equipment to circuit designs, design methodology, and applications.

Overview

Top Research Topics at IEEE International D Systems Integration Conference?

  • Electronic engineering (40.64%)
  • Optoelectronics (23.71%)
  • Silicon (19.32%)

The conference covers a variety of subjects, including Electronic engineering, Optoelectronics, Silicon, Three-dimensional integrated circuit and Composite material. While the conference focused on Electronic engineering, it was also able to explore topics like Wafer, Chip, Integrated circuit, Interconnection and Interposer. The Wafer study featured in the event draws parallels with the field of Chemical-mechanical planarization.

IEEE International D Systems Integration Conference explores issues in Optoelectronics which can be linked to other research areas like Stack (abstract data type) and Electrical engineering. CMOS is a key component of Electrical engineering research discussed in the event. While work presented in IEEE International D Systems Integration Conference provided substantial information on Silicon, it also covered topics in Layer (electronics) and Substrate (electronics).

Three-dimensional integrated circuit study tackled is connected to the field of Embedded system. The majority of Embedded system studies presented zero in on Integrated circuit design. In addition to Composite material research, it aims to explore topics under Metallurgy and Annealing (metallurgy).

What are the most cited papers published at the conference?

  • A 3D-stacked logic-in-memory accelerator for application-specific data intensive computing (109 citations)
  • Monolithic 3D integration of SRAM and image sensor using two layers of single grain silicon (74 citations)
  • Performance analysis of 3-D monolithic integrated circuits (73 citations)

Research areas of the most cited articles at IEEE International D Systems Integration Conference:

The conference papers generally zeroe in on subjects such as Electronic engineering, Three-dimensional integrated circuit, Optoelectronics, Electrical engineering and Composite material. The conference papers hold forums on Electronic engineering that merge themes from other disciplines such as Cost estimate, Interconnection and Integrated circuit. The conference papers emphasize research on Optoelectronics, which includes concerns such as Silicon.

What topics the last edition of the conference is best known for?

  • Electrical engineering
  • Integrated circuit
  • Composite material

The previous edition focused in particular on these issues:

The main research concerns discussed in IEEE International D Systems Integration Conference are Optoelectronics, Chip, Composite material, Interconnection and Three-dimensional integrated circuit. The conference explores themes in Optoelectronics like Wafer, CMOS, Insulator (electricity) and Silicon and links them with other fields of study like Stacking. The conference holds forums on Chip that merges themes from other disciplines such as Photonics, Process (computing), Waveguide (optics), Electrical impedance and Interposer.

Topics in Composite material were tackled in line with various other fields like Thin film and Annealing (metallurgy). IEEE International D Systems Integration Conference facilitates discussions on Three-dimensional integrated circuit that incorporate concepts from other fields like Die (integrated circuit), Electronic engineering, Hybrid system and Boundary scan. High speed serial link studies in the realm of Electronic engineering interact with fields like Proximity communication.

The most cited articles from the last conference are:

  • Variability Cancellation to Improve Diagnostic Performance of Testing through Silicon Vias in Power Distribution Network of 3D-IC (3 citations)
  • Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields (3 citations)
  • Low Temperature Cu to Cu Direct Bonding below 150 °C with Au Passivation Layer (3 citations)

Papers citation over time

A key indicator for each conference is its effectiveness in reaching other researchers with the papers published at that venue.

The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.

Research.com

The top authors publishing at IEEE International D Systems Integration Conference (based on the number of publications) are:

  • Takafumi Fukushima (39 papers) published 7 papers at the last edition, 3 more than at the previous edition,
  • Tetsu Tanaka (32 papers) published 5 papers at the last edition, 2 more than at the previous edition,
  • Mitsumasa Koyanagi (29 papers) published 3 papers at the last edition, 1 less than at the previous edition,
  • Eric Beyne (24 papers) published 3 papers at the last edition, 2 less than at the previous edition,
  • Paul D. Franzon (19 papers) published 1 paper at the last edition the same number as at the previous edition.

The overall trend for top authors publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top authors.

Research.com

Only papers with recognized affiliations are considered

The top affiliations publishing at IEEE International D Systems Integration Conference (based on the number of publications) are:

  • Tohoku University (63 papers) published 10 papers at the last edition, 4 more than at the previous edition,
  • Katholieke Universiteit Leuven (24 papers) published 2 papers at the last edition, 2 less than at the previous edition,
  • National Institute of Advanced Industrial Science and Technology (20 papers) published 5 papers at the last edition, 3 more than at the previous edition,
  • North Carolina State University (18 papers) published 1 paper at the last edition the same number as at the previous edition,
  • IBM (16 papers) absent at the last edition.

The overall trend for top affiliations publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top affiliations.

Research.com

Publication chance based on affiliation

The publication chance index shows the ratio of articles published by the best research institutions at the conference edition to all articles published within that conference. The best research institutions were selected based on the largest number of articles published during all editions of the conference.

The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.

Research.com

During the most recent 2019 edition, 14.49% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 42.37% were posted by at least one author from the top 10 institutions publishing at the conference. Another 15.25% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 23.73% of all publications and 18.64% were from other institutions.

Returning Authors Index

A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of conferences they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same conference from year to year.

The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the conference in relation to all participants in a given year.

Research.com

Returning Institution Index

The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.

Research.com

The experience to innovation index

Our experience to innovation index was created to show a cross-section of the experience level of authors publishing at a conference. The index includes the authors publishing at the last edition of a conference, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).

The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:

  • Novice - P < 5 or C < 25 (the number of publications less than 5 or the number of citations less than 25),
  • Competent - P < 10 or C < 100 (the number of publications less than 10 or the number of citations less than 100),
  • Experienced - P < 25 or C < 625 (the number of publications less than 25 or the number of citations less than 625),
  • Master - P < 50 or C < 2500 (the number of publications less than 50 or the number of citations less than 2500),
  • Star - P ≥ 50 and C ≥ 2500 (both the number of publications greater than 50 and the number of citations greater than 2500).

Research.com

The chart below illustrates experience levels of first authors in cases of publications with multiple authors.

Research.com

Previous Editions

IEEE International 3D System Integration Conference

Nov 15, 2021 - Nov 18, 2021

Raleigh , United States, United States

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