Cork , Ireland
Conference Dates: Dec 07, 2022 - Dec 09, 2022
The conference covers a variety of subjects, including Electronic engineering, Optoelectronics, Silicon, Three-dimensional integrated circuit and Composite material. While the conference focused on Electronic engineering, it was also able to explore topics like Wafer, Chip, Integrated circuit, Interconnection and Interposer. The Wafer study featured in the event draws parallels with the field of Chemical-mechanical planarization.
IEEE International D Systems Integration Conference explores issues in Optoelectronics which can be linked to other research areas like Stack (abstract data type) and Electrical engineering. CMOS is a key component of Electrical engineering research discussed in the event. While work presented in IEEE International D Systems Integration Conference provided substantial information on Silicon, it also covered topics in Layer (electronics) and Substrate (electronics).
Three-dimensional integrated circuit study tackled is connected to the field of Embedded system. The majority of Embedded system studies presented zero in on Integrated circuit design. In addition to Composite material research, it aims to explore topics under Metallurgy and Annealing (metallurgy).
The conference papers generally zeroe in on subjects such as Electronic engineering, Three-dimensional integrated circuit, Optoelectronics, Electrical engineering and Composite material. The conference papers hold forums on Electronic engineering that merge themes from other disciplines such as Cost estimate, Interconnection and Integrated circuit. The conference papers emphasize research on Optoelectronics, which includes concerns such as Silicon.
The main research concerns discussed in IEEE International D Systems Integration Conference are Optoelectronics, Chip, Composite material, Interconnection and Three-dimensional integrated circuit. The conference explores themes in Optoelectronics like Wafer, CMOS, Insulator (electricity) and Silicon and links them with other fields of study like Stacking. The conference holds forums on Chip that merges themes from other disciplines such as Photonics, Process (computing), Waveguide (optics), Electrical impedance and Interposer.
Topics in Composite material were tackled in line with various other fields like Thin film and Annealing (metallurgy). IEEE International D Systems Integration Conference facilitates discussions on Three-dimensional integrated circuit that incorporate concepts from other fields like Die (integrated circuit), Electronic engineering, Hybrid system and Boundary scan. High speed serial link studies in the realm of Electronic engineering interact with fields like Proximity communication.
A key indicator for each conference is its effectiveness in reaching other researchers with the papers published at that venue.
The chart below presents the interquartile range (first quartile 25%, median 50% and third quartile 75%) of the number of citations of articles over time.
The top authors publishing at IEEE International D Systems Integration Conference (based on the number of publications) are:
The overall trend for top authors publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top authors.
Only papers with recognized affiliations are considered
The top affiliations publishing at IEEE International D Systems Integration Conference (based on the number of publications) are:
The overall trend for top affiliations publishing at this conference is outlined below. The chart shows the number of publications at each edition of the conference for top affiliations.
The publication chance index shows the ratio of articles published by the best research institutions at the conference edition to all articles published within that conference. The best research institutions were selected based on the largest number of articles published during all editions of the conference.
The chart below presents the percentage ratio of articles from top institutions (based on their ranking of total papers).Top affiliations were grouped by their rank into the following tiers: top 1-10, top 11-20, top 21-50, and top 51+. Only articles with a recognized affiliation are considered.
During the most recent 2019 edition, 14.49% of publications had an unrecognized affiliation. Out of the publications with recognized affiliations, 42.37% were posted by at least one author from the top 10 institutions publishing at the conference. Another 15.25% included authors affiliated with research institutions from the top 11-20 affiliations. Institutions from the 21-50 range included 23.73% of all publications and 18.64% were from other institutions.
A very common phenomenon observed among researchers publishing scientific articles is the intentional selection of conferences they have already attended in the past. In particular, it is worth analyzing the case when the authors participate in the same conference from year to year.
The Returning Authors Index presented below illustrates the ratio of authors who participated in both a given as well as the previous edition of the conference in relation to all participants in a given year.
The graph below shows the Returning Institution Index, illustrating the ratio of institutions that participated in both a given and the previous edition of the conference in relation to all affiliations present in a given year.
Our experience to innovation index was created to show a cross-section of the experience level of authors publishing at a conference. The index includes the authors publishing at the last edition of a conference, grouped by total number of publications throughout their academic career (P) and the total number of citations of these publications ever received (C).
The group intervals were selected empirically to best show the diversity of the authors' experiences, their labels were selected as a convenience, not as judgment. The authors were divided into the following groups:
The chart below illustrates experience levels of first authors in cases of publications with multiple authors.
Nov 15, 2021 - Nov 18, 2021
Raleigh , United States, United States
IEEE International 3D System Integration Conference
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